Job title: Application Engineer/Test Engineer
Company: NOVOSENSE Microelectronics –
Job description: NOVOSENSE Microelectronics (NOVOSENSE, SSE Stock Code 688052) is a highly robust & reliable analog and mixed signal chip company. Since its establishment in 2013, the company has been focusing on sensor, signal chain, and power management, providing comprehensive semiconductor products and solutions, which are widely used in automotive, industrial, information communication and consumer electronics markets.With the mission of “Sense & Drive the Future, Build a Green, Smart and Connected World with Semiconductors”, the company is committed to providing chip-level solutions to link the digital world and the real world.Application Engineer/Test EngineerPosition Title: 应用工程师 Application Engineer (电源类/信号链类 Power/Signal Chain)Job DescriptionChip Application Development: Determine optimal application methodologies and develop hardware/software solutions for chip implementationChip Validation (Optional): Conduct chip evaluation using EVA and demo boards, generate technical reports, drive issue resolution to ensure application complianceTechnical Support: Provide pre-sales design-in support and post-sales troubleshooting, delivering customized solutions for client technical challengesTechnical Documentation Maintenance: Manage application design tools and technical collateral; Develop technical marketing materials and training programsChip Definition (Optional): Actively contribute to product specification development with focus on market competitivenessQualificationsEducation: Bachelor’s degree or higher in Electronics, Electrical Engineering, Automation or related fieldsTechnical Competencies:Proven design experience in specific application domainsStrong fundamentals in circuit design and automatic control systemsHands-on experience with hardware/software co-design and debuggingProficiency in operating laboratory test equipment (oscilloscopes, signal analyzers, etc.)Position: 测试开发工程师 Test EngineerJob DescriptionTestability Design & Test Planning
1.1 Collaborate with design engineers, system engineers, and application engineers on testability design (DFT) prior to chip tape-out
1.2 Select optimal testers and handlers based on chip design specifications, quality requirements, and cost targets, delivering comprehensive test feasibility analysis
1.3 Develop test plans and solutions through DFT analysis, coordinating reviews with cross-functional teamsTest Solution Development & Automation
2.1 Establish lab automation platforms for efficient chip characterization and reliability testing (optional)
2.2 Design CP/Wafer Sort and FT/Final Test hardware, managing fabrication of load boards, probe cards, sockets, and DUT boards with vendors
2.3 Develop production ATE programs aligning with test specs, perform benchmarking against lab validation dataEngineering Pilot & External Coordination
3.1 Release test programs/hardware for engineering lot qualification, analyze initial yield data with application teams
3.2 Support offshore manufacturing partners in troubleshooting site failures, low yield, and sampling issues during qualificationQuality Enhancement & Cost Optimization
4.1 Drive test coverage improvements through failure analysis of customer returns, ensuring test repeatability/reproducibility
4.2 Optimize test programs for maximum parallelism and throughput; Proactively explore and adopt new testing methodologies for cost reductionQualifications
Solid foundation in analog/digital circuit theoryProficient in C/C++/C#/LabVIEW programming
Expected salary:
Location: Shanghai
Job date: Fri, 07 Feb 2025 05:22:17 GMT
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